A new form of nano-reinforced leadfree solder paste was applied to assemble the ultra-fine capacitor (i.e., 01005 size) onto the printed circuit board by applying the reflow soldering method.
Lead-free SAC solder paste was reinforced with different weighted percentages of Fe 2 O 3 nanoparticles (i.e., 0.01, 0.05, and 0.15 wt.%) using a mechanical solder paste mixer. This paper presents the influence of Fe 2 O 3 nanoparticles on the microstructure and fillet height for the ultra-fine electronics assembly in the reflow soldering process.
